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JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes

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Shenzhen Hiner Technology Co., Ltd.

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JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes

Name: JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes
Brand: Hiner-pack
Price: 1.35 USD

China JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes factory

Cavity Size : 18.5×11.6×4.26 mm

Model Number : HN25083

Reusable : Yes

Payment Terms : T/T

Color : Black

Incoterms : EXW, FOB, CIF, DDU, DDP

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

MOQ : 500 pcs

Delivery Time : 10 workdays

Mold Type : Injection

Clean Class : General And Ultrasonic Cleaning

Brand Name : Hiner-pack

Tray Shape : Rectangular

Packaging Details : CARTON, PALLET

Place of Origin : China

Ic Type : BGA,QFP,QFN,LGA,PGA

Certification : ROHS, ISO

Packing Level : Transport package

Flatness : Less than 0.76mm

Capacity : 20x5=100 PCS

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JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes

Constructed from high‑performance Mppo material, hold integrated circuit parts securely. Resist high operating heat and block outside contaminants. Maintain stable performance through repeated circulation inside semiconductor workshops.

Meet diverse chip layout requirements. Custom cavity development serves as core offering. Adjust cavity dimension, slot quantity and overall tray outline to match varied chip samples and project standards.

Fit mainstream semiconductor production workflows. Keep steady supporting performance for long‑time mass‑use. Bring consistent protection from component loading all the way to finished‑part outgoing shipment.

Key Features/ Benefits

Excellent high‑temperature resistance
Dust reduction and anti-contamination
Support full cavity custom development
Secure component retention
Durable for repeated circulation

Specifications

Brand		Hiner-pack
Model		HN25083
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×9.5 mm
Cavity Size		18.5×11.6×4.26 mm
Matrix QTY		20x5=100 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suit semiconductor chip packaging and assembly workflows. Hold integrated circuit components steady during automated production operations.

Fit bulk component storage and inter‑workshop transit. Protect delicate chips against dust and scratch. Accept custom modification for special non‑standard chip types.

Packaging & Shipping/ Services

Get stacked with separating protective boards, then packed into thick carton cases. Lower scratch and collision risks during inner‑site handling.

Support sea, air and express delivery modes. Arrange stable production lead‑time. Adopt reinforced outer package to reduce damage risk for long‑distance overseas shipment.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes Images

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