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Brand Name : Hiner-pack
Model Number : HN24030
Place Of Origin : Shenzhen, China
Certification : ISO 9001 ROHS SGS
MOQ : 1000 Pcs
Price : $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
Packaging Details : It Depends On The QTY Of Order And Size Of Product
Delivery Time : 5~8 Working Days
Payment Terms : T/T
Supply Ability : 4000PCS~5000PCS/per Day
Warpage : <0.2mm
Property : ESD Or Non-ESD
Heat Resistant : Yes
Surface Resistance : 1.0x10E4~1.0x10E11Ω
Material : ABS, PC, PPE, MPPO, PEI, HIPS...etc.
Use : Transport, Storage, Packing
Capacity : Holds Multiple Bare Dies
ESD-Proof Tray For Chip Module Packaging And Secure Handling
The Chip Tray & Waffle Pack series from Hiner-pack offers a safe and convenient solution for packaging and transporting a variety of microelectronic components including Chip, Die, COG, Optoelectronic devices, and more. These products come in various sizes and materials to suit different needs, with product specifications available in 2 inches and 4 inches. The materials used include Antistatic/Conductive ABS and PC, and can also be tailored to meet specific customer requirements.
The products are crafted from ESD-safe, non-sloughing, and carbon-powder-free clean polymers.
They are further reinforced with carbon fiber to enhance their strength and ensure permanent ESD protection. This design feature provides added durability and longevity to the products.
With the capability of withstanding bake temperatures of up to 180°C, these items offer versatility in various environments and applications. This high temperature tolerance adds to their practicality and usability.
Available in industry-standard formats, these products can also be customized to meet specific requirements and preferences. This customization option allows for tailored solutions that cater to individual needs.
HN24030 Technical Data Ref. | ||||
Base Information | Material | Color | Matrix QTY | Pocket Size |
ABS | Black | 8*8=64PCS | 3.65*3.65*0.8mm | |
Size | Length * Width * Height (according to customer's requirement) | |||
Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
Sample | A. The free samples: Choosen from existing products. | |||
B. Customized samples as per your design/demand | ||||
Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
Artowrk Format | PDF,2D,3D |
The external dimensions of waffle pack chip trays are well established: 2-inch is two inches square, 4-inch is four inches square, and so on. The variability is in the pocket size, geometry and count.
Waffle pack trays are usually specified by a few characteristics.
Custom waffle pack trays require additional specification.
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Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD Images |